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yyyyyy x. yyyyyy

0000 xxxxxx xxxx , xxxx , xxxxx 00000

xxx-xxx-xxxx • abc@xyz.com

 

 

proficient engineer eager to contribute management expertise as well as strong final assembly and testing talents toward actively supporting an organization in maximizing performance.

 

profile

 

  • talented engineer offering solid and progressive management experience, including expertise within final assembly, testing and personnel training capacities.
  • in depth expertise in the mark inspection system, including tape and reel, 2d/3d mechanical scan inspection, final test, burn in, and packaging assembly.
  • consistently ensured delivery of quality customer service vital to sustaining and growing clientele base; a warded customer s satisfaction for 1995.
  • adept at blending strong decision-making abilities with outstanding organizational skills, solid leadership attributes, and successful interpersonal relationship-building techniques.
  • apply sharp problem-solving proficiencies, intelligent business acumen, and cost-effective strategies, along with exceptional written and verbal communication skills, to any professional environment.
  • fluent in both english and vietnamese, language and culture.

 

professional experience

 

senior electrical engineer freescale semiconductor, inc.                                                                     2005-present

  • actively serve as engineer for packaging solution development groups, responsible for the substrate design of the new test vehicle.
  • successfully implement test structures on the test vehicle, from delamination corner and edge/crack detectors to aluminum power distribution and heater/sensors.
  • efficiently review and approval design rule for wire bond and flip chip, responsible for the development of new test system for packaging with 4-point test.
  • spearhead the design of universal test load board for test vehicle devices on the teradyne testers and hast test fixture and program.
  • drive the technology certification for the new packaging, successfully supervising implementation into pilot line for mass production; suggested stagger bond pads that increased yield by 14%.

 

senior electrical engineer motorola, inc.                                                                                                  2000-2005

  • responsible for designing test technology center, including supervising technical team of 6 engineers and implementing training course for technicians/product engineers.
  • successfully developed innovative new test, effectively reducing chip cycle time by combining burn in and test.
  • collaborated with product/test engineers in the installation of burn in/test system, producing know good die.
  • effectively developed software in c to convert micro controller codes to test patterns for the burn in/test system.
  • wrote perl script to convert test patterns from teradyne j973/j971, j750 to tel wafer burn-in and test system.

 

senior application engineer robotics vision systems, inc.                                                                        1995-2000

  • serving as design and application engineering, assisted in the integration of tape and reel system on the rvsi scan machine.
  • successfully developed new mark inspection for customers, trained all mark inspection system relates and set up tape and reel system for final assembly.
  • effectively provided both support and training for all applications on the laser scan 3d inspection systems, used to inspect qfp, tsop, bga chips.

 

design engineer american technical ceramics                                                                                             1987-1995

  • responsible for designing tape and reel system for in-house use, as well as the development of innovative laser mark for the company logo on the chips.
  • proficiently developed a detailed training course, excellence for new technicians on behalf of company.
  • effectively developed the assembly code for the micro controllers for the automation systems.

professional education

 

coursework toward a master s in computer science ny institute of technology old westbury, ny           1992-1995

bachelors of science electrical engineering suny at stony brook    stony brook, ny                                1982-1986

yyyyyy x. yyyyyy

0000 xxxxxx xxxx , xxxx , xxxxx 00000

xxx-xxx-xxxx • abc@xyz.com

 

 

 

 

 

date

 

 

 

 

hiring agent name

title

company name

address

city/state/zip code

 

dear__________________:

 

i am currently seeking a challenging career opportunity in an assembly management capacity and am submitting my resume for your review.  in advance, thank you for your time and consideration.

 

as demonstrated in the accompanying resume, my professional qualifications include extensive experience in the mark inspection system, including tape and reel, 2d/3d mechanical scan inspection, final test, burn in, and packaging assembly. an examination of my credentials will confirm that i am a skilled professional who thrives in a challenging work environment. i am driven, independently motivated, and results-oriented. i enjoy a challenge and work hard to achieve success. it is my practice to operate within a strict conduct of professionalism and integrity with my employees. to complement this background, i offer dynamic leadership, communication and relationship management skills.

 

as an employee, you will find me to be a driven team player committed to supporting you in achieving your objectives through superior performance.  i am confident that i could be a valuable asset to your company, and look forward to interviewing with you in the near future.

 

sincerely,

 

 

 

 

 

 

yyyyyy x. yyyyyy

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